樣品分析需求

No Cost Ultrasonic Defect Inspection 

Let us show you how to find the smallest defects with non-destructive ultrasonic inspection on microelectronic packages, bonded semiconductor wafers, MEMS, image sensors, materials analysis, and other components.

Our complimentary sample inspection provides

  • Non-destructive sub-surface imaging not available with other inspection technologies

  • Detailed report with high resolution images illustrating detected defects

  • Access to our most recent system platforms and optional features

  • Determination of the most appropriate system configuration and application techniques to optimize defect sensitivity and throughput for your inspection needs

  • Work performed under non-disclosure agreement if required

 

這些的晶圓檢測影像能夠清楚指出由於顆粒及空氣陷入所造成的孔洞,如絕緣層覆矽 (SOI)(左)及陽極(右)的鍵合晶圓對所示。

本公司免費提供的超音波檢測技術,能將您的晶圓、封裝設備或材料產品缺陷逐一揭露。而我們的分析報告更可助您充分掌握造成缺陷的原因 – 好讓您能夠逐一修正。

今天就請您大腳邁出創造更高品質及生產率的第一步。從 Sonix – 超音波檢測的領導者,申請免費的材料、晶圓或封裝檢測開始。

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